Say, ECNakajima, MSenawongse, PSoyman, MOzer, FTagami, J2020-03-262020-03-2620050361-77341559-2863https://hdl.handle.net/20.500.12395/19615This study aimed to evaluate the microtensile bond strength (muTBS) of photo- and dual-cure adhesives to sound and caries-affected dentin using total- and self-etch techniques. Human third molars with occlusal caries were prepared as previously described by Nakajima and others (1995). Dentin surfaces were bonded with Optibond Solo Plus (Kerr; photo-cure adhesive) or Optibond Solo Plus + Dual-cure activator (Kerr; dual-cure adhesive) with total- and self-etch technique. Clearfil AP-X (Kuraray) was used for composite buildups. Following storage in distilled water at 37degreesC for 24 hours, the teeth were sectioned into 0.7-mm thick slices to obtain sound and caries-affected dentin slabs, then trimmed to form hour glass shapes with a 1 mm(2) cross-sectional area. The specimens were subjected to microtensile testing using EZ-test (Shimadzu) at 1 mm/minute. Data were analyzed using three-way ANOVA and Student's t-Test (p<0.05). Bond strengths to sound dentin with photo- and dual-cure adhesives using total- and self-etch techniques were significantly higher than those to caries-affected dentin. Dual-cure adhesive significantly decreased bond strengths both to sound and caries-affected dentin. The total-etch technique showed no beneficial effect on caries-affected dentin compared with the self-etch technique. Scanning electron microscopic observation of the resin-dentin interfaces revealed that hybrid layers in caries-affected dentin were thicker than those observed in sound dentin with photo- and dual-cure adhesives. Resin infiltration into dentinal tubules of caries-affected dentin was hampered by the presence of mineral deposits.eninfo:eu-repo/semantics/openAccessArticle301909815765963Q1WOS:000226843500014Q2