Soydal, UlkuAhmetli, Gulnare2020-03-262020-03-2620180272-83971548-0569https://dx.doi.org/10.1002/pc.23985https://hdl.handle.net/20.500.12395/37052The purpose of this study is to develop epoxy composites with improved mechanical, thermal, and electrical properties. Semiconducting glass (SG) binary systems such as As2S3-TlS and As2Se3-TlS were synthesized in various mole ratios (1:1 and 1:3). Electrically conductive DGEBA-type epoxy-SG-filled composites were developed containing 1-15 wt% of fillers and characterized by X-ray diffraction and scanning electron microscopy techniques. As a result, the effects of the type and amount of semiconductive filler on the mechanical, thermal, and electrical properties of commercial epoxy resins (ERs) were examined. It was found that I-2 doping of the filler significantly increased the electrical conductivity of the composites up to 10(-3) S cm(-1). Percolation concentrations were found to be 7 wt% for all composites studied. The maximum tensile strength changed in the range of 86-114 MPa was obtained with 5-10 wt% of SG particles. In addition, the thermal behavior and stability of the epoxy composites were studied using thermogravimetric analysis. The incorporation of SG particles increased the 10% decomposition temperature of neat epoxy by 5 degrees C-35 degrees C. ER/SG coatings showed the best adhesion results and perfect resistance to 3% NaCl, 3% HCl, and 5% NaOH solutions. POLYM. COMPOS., 39:681-690, 2018. (c) 2016 Society of Plastics Engineersen10.1002/pc.23985info:eu-repo/semantics/closedAccessArticle393681690Q1WOS:000426747000010Q2