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    Bonding to sound vs caries-affected dentin using photo- and dual-cure adhesives
    (OPERATIVE DENTISTRY INC, 2005) Say, EC; Nakajima, M; Senawongse, P; Soyman, M; Ozer, F; Tagami, J
    This study aimed to evaluate the microtensile bond strength (muTBS) of photo- and dual-cure adhesives to sound and caries-affected dentin using total- and self-etch techniques. Human third molars with occlusal caries were prepared as previously described by Nakajima and others (1995). Dentin surfaces were bonded with Optibond Solo Plus (Kerr; photo-cure adhesive) or Optibond Solo Plus + Dual-cure activator (Kerr; dual-cure adhesive) with total- and self-etch technique. Clearfil AP-X (Kuraray) was used for composite buildups. Following storage in distilled water at 37degreesC for 24 hours, the teeth were sectioned into 0.7-mm thick slices to obtain sound and caries-affected dentin slabs, then trimmed to form hour glass shapes with a 1 mm(2) cross-sectional area. The specimens were subjected to microtensile testing using EZ-test (Shimadzu) at 1 mm/minute. Data were analyzed using three-way ANOVA and Student's t-Test (p<0.05). Bond strengths to sound dentin with photo- and dual-cure adhesives using total- and self-etch techniques were significantly higher than those to caries-affected dentin. Dual-cure adhesive significantly decreased bond strengths both to sound and caries-affected dentin. The total-etch technique showed no beneficial effect on caries-affected dentin compared with the self-etch technique. Scanning electron microscopic observation of the resin-dentin interfaces revealed that hybrid layers in caries-affected dentin were thicker than those observed in sound dentin with photo- and dual-cure adhesives. Resin infiltration into dentinal tubules of caries-affected dentin was hampered by the presence of mineral deposits.
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    Microtensile bond strength of a filled vs unfilled adhesive to dentin using self-etch and total-etch technique
    (ELSEVIER SCI LTD, 2006) Say, EC; Nakajima, M; Senawongse, P; Soyman, M; Ozer, F; Ogata, M; Tagami, J
    Objective: The purpose of this study was to evaluate the effect of a filled adhesive (One-Step Plus; Bisco) versus an unfilled adhesive (One-Step; Bisco) on the microtensite bond strength (mu TBS) to dentin using total-etch (Uni-etch; Bisco) and self-etch (Tyrian SPE; Bisco) techniques. Methods: Twenty extracted human third molars were ground flat to expose occlusal dentin. After the dentin surfaces were polished with 600-grit SiC paper, the teeth were randomly assigned to four groups according to the bonding agent and technique being used. Dentin surfaces were bonded with One-Step Plus + total-etch; One-Step Plus+self-etch; One- Step+ total-etch and One-Step + self-etch. Composite buildups were performed with Clearfil AP-X (Kuraray Medical). Following storage in distilled water at 37 degrees C for 24 h, the bonded specimens were serially sectioned into 0.7 mm-thick stabs and then trimmed to hour-glass shapes with a 1 mm? cross-sectional area (n = 20). Microtensile bond strengths were determined using the EZ-test (Shimadzu) at a cross-head speed of 1 mm/min. Data were analyzed using two-way ANOVA and Tukey's post hoc test. Results: There were no significant differences in the mu TBS between One-Step Plus and One-Step adhesives when they were used with the total-etch and self-etch techniques (p > 0.05). However with the total-etch technique both adhesives yielded significantly higher bond strength values than the self-etch technique (p < 0.001). Conclusion: The fitted adhesive One-Step Plus did not show any beneficial effect than the unfilled adhesive One-Step on the mu TBS to dentin with total-etch and self-etch techniques. Irrespective from the adhesive type, self-etch technique revealed lower bond strengths than the total-etch technique. (c) 2005 Elsevier Ltd. All rights reserved.