International congress on semiconductor materials and devices

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dc.contributor.authorYüksel, Ö. Faruk.
dc.contributor.authorTürüt, Abdülmecit
dc.contributor.authorKarabulut, Elife Öznur.
dc.date.accessioned2020-03-26T20:14:48Z
dc.date.available2020-03-26T20:14:48Z
dc.date.issued2019
dc.departmentSelçuk Üniversitesi, Fen Fakültesi, Fizik Bölümüen_US
dc.descriptionInternational Congress on Semiconductor Materials and Devices (ICSMD) -- AUG 17-19, 2017 -- Selcuk Univ, Konya, TURKEYen_US
dc.description.abstractThe International Congress on Semiconductor Materials and Devices (ICSMD-2017) was held in Konya, Turkey for the first time at Selcuk University between the 17th and 19th of August, 2017. The main aim of the congress was to bring together researchers from both academic and industrial community, working in the field of semiconductor science and technology, and to promote the exchange of their ideas and results, as well as to foster collaboration between them. The scientific topic of the congress spanned a broad range of research fields on 1) Semiconductor Materials and Devices, 2) Thin Films: Surface and Interface, 3) Nanofabrication, Nanotubes, and Nanowires, 4) Photonic Devices and Sensors, 5) Organic Semiconductors and Devices, 6) Magnetic Semiconductors, 7) Biological Applications of Semiconductors, 8) Computational Methods Applied to Semiconductor Materials. There were about 200 national and international participants comprised of university students, academicians, and experts from the industry. A total of 65 oral presentations, including 8 invited speakers, were given and about 150 posters were presented. The presentations mostly gave a critical assessment of existing work and future directions in semiconductor growth and device technology, including materials characterization and device fabrication processes, growth of semiconductors, photovoltaic materials, Schottky barrier diodes and hybrid organic/inorganic semiconductor devices. This special issue of Materials Today: Proceedings features 26 peer-reviewed articles which provide a general overview of topics in the field of semiconductor materials and devices discussed in ICSMD-2017. The guest editors are thankful to all the participants, and all the authors who contributed their time and effort submitting their excellent and extended works to the present special issue. The guest editors would also like to thank all the reviewers for their valuable comments and suggestions to the authors on improving the quality of the papers. (C) 2019 Elsevier Ltd. All rights reserved.en_US
dc.description.sponsorshipSelcuk UniversitySelcuk University; Solimpeks Solar Energy Corp; Selcuklu Municipality; Sisecam; Ligant; Konya Commodity Exchange; Konya Chamber of Industry; Yunak Municipality; Optomek; Renkoen_US
dc.description.sponsorshipSelcuk University, Solimpeks Solar Energy Corp, Selcuklu Municipality, Sisecam, Ligant, Konya Commodity Exchange, Konya Chamber of Industry, Yunak Municipality, Optomek, Renko.en_US
dc.identifier.citationYüksel, Ö. F., Türüt, A., Karabulut, E. Ö. (2019) International Congress on Semiconductor Materials and Devices. Materials Today-Proceedings, 18(5), 1793-1795.
dc.identifier.endpage1795en_US
dc.identifier.issn2214-7853en_US
dc.identifier.startpage1793en_US
dc.identifier.urihttps://doi.org/10.1016/j.matpr.2019.06.665
dc.identifier.urihttps://hdl.handle.net/20.500.12395/37938
dc.identifier.volume18en_US
dc.identifier.wosWOS:000495858400001en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.institutionauthorYüksel, Ö. Faruk.
dc.institutionauthorKarabulut, Elife Öznur.
dc.language.isoenen_US
dc.publisherELSEVIERen_US
dc.relation.ispartofMATERIALS TODAY-PROCEEDINGSen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.selcuk20240510_oaigen_US
dc.subjectICSMD-2017en_US
dc.subjectsemiconductor materialsen_US
dc.subjectsemiconductor devicesen_US
dc.titleInternational congress on semiconductor materials and devicesen_US
dc.typeConference Objecten_US

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