Temperature rise during adhesive and resin composite polymerization with various light curing sources

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dc.contributor.authorOzturk, B
dc.contributor.authorOzturk, AN
dc.contributor.authorUsumez, A
dc.contributor.authorUsumez, S
dc.contributor.authorOzer, F
dc.date.accessioned2020-03-26T16:55:31Z
dc.date.available2020-03-26T16:55:31Z
dc.date.issued2004
dc.departmentSelçuk Üniversitesien_US
dc.description.abstractThis study evaluated the temperature rise in two different adhesive (Clearfil SE Bond [CSEB] and EBS-Multi [EBSM]) and composite systems (Clearfil AP-X [CAPX,] Pertac II [PII]) by the same manufacturer when illuminated by four different light sources: Light-emitting diode (LED), Plasma arc curing (PAC), high intensity quartz tungsten halogen (HQTH) and quartz tungsten halogen (QTH). Forty dentin disks were prepared from extracted premolars. These dentin disks were placed in apparatus developed to measure temperature rise. Temperature rise during photopolymerization of adhesive resin and resin composite was then measured. The mean values of temperature increases for adhesive and resin composites did not differ significantly (p = 0.769). The highest temperature rise was observed during photopolymerization of EBSM with PAC (5.16degreesC) and HQTH (4.28degreesC), respectively. Temperature rise values produced by QTH (1.27degreesC - 2.83degreesC for adhesive resin; 1.86degreesC - 2.85degreesC for resin composite) for both adhesive and resin composites were significantly lower than those induced by PAC and HQTH (p < 0.05). However, these values were significantly higher than those produced by LED (1.16degreesC - 2.08degreesC for adhesive resin; 1.13degreesC - 2.59degreesC for resin composite). Light sources with high energy output (PAC and HQTH) caused significantly higher temperature rise than sources with low energy output (QTH and LED). However, in this study, no temperature rises beneath 1-mm dentin disk exceed the critical 5.6degreesC value for pulpal health.en_US
dc.identifier.endpage332en_US
dc.identifier.issn0361-7734en_US
dc.identifier.issue3en_US
dc.identifier.pmid15195734en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage325en_US
dc.identifier.urihttps://hdl.handle.net/20.500.12395/19222
dc.identifier.volume29en_US
dc.identifier.wosWOS:000221412700013en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakPubMeden_US
dc.language.isoenen_US
dc.publisherOPERATIVE DENTISTRY INCen_US
dc.relation.ispartofOPERATIVE DENTISTRYen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.selcuk20240510_oaigen_US
dc.titleTemperature rise during adhesive and resin composite polymerization with various light curing sourcesen_US
dc.typeArticleen_US

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